In modern electronics manufacturing, the quality of printed circuit board assemblies (PCBA) directly affects the reliability and performance of the final product. During PCBA processing, poor adhesion of solder paste is a common problem, which may lead to welding defects, poor contacts and even product failure. As a new type of surface treatment equipment, atmospheric plasma cleaning machine provides an efficient and environmentally friendly solution to solve the problem of poor adhesion of PCBA solder paste.

一、Pain points of traditional craftsmanship and advantages of plasma technology

1. Disadvantages of traditional methods: ① Chemical cleaning residual solvents may cause secondary pollution;② Mechanical polishing destroys surface bonds of the substrate;③CO? cleaning equipment is costly and complex to maintain 2. Advantages of plasma cleaning: ① Fast processing speed: Plasma cleaning speed is fast and processing can be completed in a short time; ② Wide applicability: It is suitable for PCBs of various materials and shapes, and has strong versatility; ③ Environmentally friendly and efficient: Plasma treatment does not use chemical solvents, avoiding environmental pollution and health risks to operators.

二、Atmospheric plasma cleaner solves poor adhesion of PCBA solder paste

1. Improve surface hydrophilicity       After plasma cleaning, the hydrophilicity of the PCB surface will be significantly improved. When the plasma interacts with the surface, polar groups, such as hydroxyl and carboxyl groups, will be introduced to the surface, which increases the wettability of the surface and allows for better subsequent coating and welding processes.       For solder paste adhesion, good hydrophilicity helps the solder paste better wet the PCB surface and improve adhesion and soldering quality. Research shows that after low-temperature plasma cleaning, the contact angle of water droplets on the pad surface is significantly reduced, indicating that plasma cleaning can effectively improve the hydrophilicity of the bonding surface and reduce the surface tension of the pad, which is conducive to the spreading of solder balls and the formation of a good bonding interface.

2. High surface energy and adhesion       Atmospheric plasma cleaning machines can make the PCB surface microscopically rough and increase surface energy. This helps subsequent coatings and films to better bond with the PCB surface.       Plasma treatment can change the state of surface functional groups and form highly polar chemical groups, which is conducive to improving the adhesion of the bonding interface. By improving the surface chemical energy and wettability of the bonding zone, the bonding failure rate can be reduced, thereby improving the long-term reliability of the product.

3. Improve wetting properties       After plasma cleaning, the wettability of the solder paste will be significantly improved. Good wetting properties help the solder paste evenly distribute on the pad and form good solder joints.